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ID 32919
FullText URL
Author
Sumimoto, Tetsuhiro
Mondou, Munehiro
Furukawa, Noboru
Okada, Saburo
Abstract

In the surface mount technology, a ball grid array (BGA) has been used in the production of PC boards. This paper deals with the detection of defects at BGA solder joints in PC boards by using X-ray imaging. Types of defects at BGA solder joints are solder bridge, missing connection, solder voids, open connection and misregistration of parts. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to the speed of the production line. To get the design data for the development of the inspection system used in the surface mount process, it is important to develop image analysis techniques based on X-ray image data. At the first step of our study, we attempt to detect the characteristics of the solder bridges based on the image analysis technique.

Keywords
X-ray imaging
ball grid arrays
inspection
printed circuit manufacture
quality control
surface mount technology
Note
Digital Object Identifier: 10.1109/ICIT.2002.1189898
Published with permission from the copyright holder. This is the institute's copy, as published in Industrial Technology, 2002. IEEE ICIT '02. 2002 IEEE International Conference on, 11-14 Dec. 2002, Volume 1, Pages 191-196.
Publisher URL:http://dx.doi.org/10.1109/IMTC.2001.928811
Copyright © 2001 IEEE. All rights reserved.
Published Date
2002-12
Publication Title
Industrial Technology
Volume
volume1
Start Page
191
End Page
196
Content Type
Journal Article
language
英語
Refereed
True
DOI
Submission Path
weights_and_measures/11