start-ver=1.4 cd-journal=joma no-vol=1 cd-vols= no-issue= article-no= start-page=4 end-page=9 dt-received= dt-revised= dt-accepted= dt-pub-year=2003 dt-pub=20038 dt-online= en-article= kn-article= en-subject= kn-subject= en-title= kn-title=High-speed simulation of PCB emission and immunity with frequency-domain IC/LSI source models en-subtitle= kn-subtitle= en-abstract= kn-abstract=

Some recent results from research conducted in the EMC group at Okayama University are reviewed. A scheme for power-bus modeling with an analytical method is introduced. A linear macro-model for ICs/LSIs, called the LECCS model, has been developed for EMI and EMS simulation. This model has a very simple structure and is sufficiently accurate. Combining the LECCS model with analytical simulation techniques for power-bus resonance simulation provides a method for high-speed EMI simulation and decoupling evaluation related to PCB and LSI design. A useful explanation of the common-mode excitation mechanism, which utilizes the imbalance factor of a transmission line, is also presented. Some of the results were investigated by implementing prototypes of a high-speed EMI simulator, HISES.

en-copyright= kn-copyright= en-aut-name=WadaOsami en-aut-sei=Wada en-aut-mei=Osami kn-aut-name= kn-aut-sei= kn-aut-mei= aut-affil-num=1 ORCID= en-aut-name=WangZhi Liang en-aut-sei=Wang en-aut-mei=Zhi Liang kn-aut-name= kn-aut-sei= kn-aut-mei= aut-affil-num=2 ORCID= en-aut-name=WatanabeTetsushi en-aut-sei=Watanabe en-aut-mei=Tetsushi kn-aut-name= kn-aut-sei= kn-aut-mei= aut-affil-num=3 ORCID= en-aut-name=FukumotoYukihiro en-aut-sei=Fukumoto en-aut-mei=Yukihiro kn-aut-name= kn-aut-sei= kn-aut-mei= aut-affil-num=4 ORCID= en-aut-name=ShibataOsamu en-aut-sei=Shibata en-aut-mei=Osamu kn-aut-name= kn-aut-sei= kn-aut-mei= aut-affil-num=5 ORCID= en-aut-name=TakahashiEiji en-aut-sei=Takahashi en-aut-mei=Eiji kn-aut-name= kn-aut-sei= kn-aut-mei= aut-affil-num=6 ORCID= en-aut-name=OsakaHideki en-aut-sei=Osaka en-aut-mei=Hideki kn-aut-name= kn-aut-sei= kn-aut-mei= aut-affil-num=7 ORCID= en-aut-name=MatsunagaShigeki en-aut-sei=Matsunaga en-aut-mei=Shigeki kn-aut-name= kn-aut-sei= kn-aut-mei= aut-affil-num=8 ORCID= en-aut-name=KogaRyuji en-aut-sei=Koga en-aut-mei=Ryuji kn-aut-name= kn-aut-sei= kn-aut-mei= aut-affil-num=9 ORCID= affil-num=1 en-affil= kn-affil=Okayama University affil-num=2 en-affil= kn-affil=Okayama University affil-num=3 en-affil= kn-affil=Industrial Technology Center of Okayama Prefecture affil-num=4 en-affil= kn-affil=Matsushita Electric Industrial Coporation Limited affil-num=5 en-affil= kn-affil=Matsushita Electric Industrial Coporation Limited affil-num=6 en-affil= kn-affil=Matsushita Electric Industrial Coporation Limited affil-num=7 en-affil= kn-affil=Hitachi Limited affil-num=8 en-affil= kn-affil=Okayama University affil-num=9 en-affil= kn-affil=Okayama University en-keyword=printed circuit board kn-keyword=printed circuit board en-keyword=modeling kn-keyword=modeling en-keyword=power-bus resonance kn-keyword=power-bus resonance en-keyword=device kn-keyword=device en-keyword=model kn-keyword=model en-keyword=common mode kn-keyword=common mode en-keyword=imbalance kn-keyword=imbalance en-keyword=EMI simulator kn-keyword=EMI simulator en-keyword=HISES kn-keyword=HISES END