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ID 32915
フルテキストURL
著者
Sumimoto, Tetsuhiro Okayama University
Maruyama, Toshinori Okayama University
Azuma, Yoshiharu Okayama University
Goto, Sachiko Okayama University
Mondou, Munehiro Eastern Hiroshima Prefecture Industrial Research Institute
Furukawa, Noboru Eastern Hiroshima Prefecture Industrial Research Institute
Okada, Saburo National Institute of Advanced Industrial Science and Technology
抄録

In the surface mount technology, Ball Grid Array (BGA) has been used in a production of PC boards, because of their excellent characters such as high density of the lead pin pitch, better lead rigidity and self-alignment during re-flow processing. This paper deals with the development of image analysis for the detection of defects at BGA solder joints in PC boards by using X-ray images. In the conventional IC boards, it is possible to detect defects of solder joints by visual inspection, because the lead of IC package is set on its outside. However, we can't detect visually defects at BGA solder joints, because they are hidden under the IC package. In a production line, the inspection of BGA in PC boards depends on the function test of electric circuits in the final process. To improve a cost performance and the reliability of PC boards, an inspection of BGA is required in the surface mount process. Types of defects at BGA solder joints are solder bridge, missing connection, solder voids, open connection and miss-registration of parts. As we can find mostly solder bridge in these defects, we pick up this to detect solder bridge in a production line. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on X-ray image data. At the first step of our study, we attempt to detect the characteristic of the solder bridges based on an image analysis.

キーワード
X-ray imaging
ball grid arrays
image processing
inspection
printed circuit manufacture
quality control
surface mount technology
備考
Published with permission from the copyright holder. This is the institute's copy, as published in Instrumentation and Measurement Technology Conference, 2003. IMTC '03. Proceedings of the 20th IEEE, 20-22 May 2003, Volume 2, Pages 1131-1136.
Publisher URL:http://ieeexplore.ieee.org/search/wrapper.jsp?arnumber=1207930
Copyright © 2003 IEEE. All rights reserved.
発行日
2003-5
出版物タイトル
Instrumentation and Measurement Technology Conference
2巻
開始ページ
1131
終了ページ
1136
資料タイプ
学術雑誌論文
言語
English
査読
有り
Submission Path
weights_and_measures/12