このエントリーをはてなブックマークに追加
ID 32919
フルテキストURL
著者
Sumimoto, Tetsuhiro Okayama University
Maruyama, Toshinori Okayama University
Azuma, Yoshiharu Okayama University
Goto, Sachiko Okayama University
Mondou, Munehiro Eastem Hiroshima Prefecture Industrial Research Institute
Furukawa, Noboru Eastern Hiroshima Prefecture Industrial Research Institute
Okada, Saburo National Institute of Advanced Industrial Science and Technology
抄録

In the surface mount technology, a ball grid array (BGA) has been used in the production of PC boards. This paper deals with the detection of defects at BGA solder joints in PC boards by using X-ray imaging. Types of defects at BGA solder joints are solder bridge, missing connection, solder voids, open connection and misregistration of parts. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to the speed of the production line. To get the design data for the development of the inspection system used in the surface mount process, it is important to develop image analysis techniques based on X-ray image data. At the first step of our study, we attempt to detect the characteristics of the solder bridges based on the image analysis technique.

キーワード
X-ray imaging
ball grid arrays
inspection
printed circuit manufacture
quality control
surface mount technology
備考
Digital Object Identifier: 10.1109/ICIT.2002.1189898
Published with permission from the copyright holder. This is the institute's copy, as published in Industrial Technology, 2002. IEEE ICIT '02. 2002 IEEE International Conference on, 11-14 Dec. 2002, Volume 1, Pages 191-196.
Publisher URL:http://dx.doi.org/10.1109/IMTC.2001.928811
Copyright © 2001 IEEE. All rights reserved.
発行日
2002-12
出版物タイトル
Industrial Technology
1巻
開始ページ
191
終了ページ
196
資料タイプ
学術雑誌論文
言語
English
査読
有り
DOI
Submission Path
weights_and_measures/11