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ID 30213
フルテキストURL
著者
Wada, Osami Okayama University
Wang, Zhi Liang Okayama University
Watanabe, Tetsushi Industrial Technology Center of Okayama Prefecture
Fukumoto, Yukihiro Matsushita Electric Industrial Coporation Limited
Shibata, Osamu Matsushita Electric Industrial Coporation Limited
Takahashi, Eiji Matsushita Electric Industrial Coporation Limited
Osaka, Hideki Hitachi Limited
Matsunaga, Shigeki Okayama University
Koga, Ryuji Okayama University
抄録

Some recent results from research conducted in the EMC group at Okayama University are reviewed. A scheme for power-bus modeling with an analytical method is introduced. A linear macro-model for ICs/LSIs, called the LECCS model, has been developed for EMI and EMS simulation. This model has a very simple structure and is sufficiently accurate. Combining the LECCS model with analytical simulation techniques for power-bus resonance simulation provides a method for high-speed EMI simulation and decoupling evaluation related to PCB and LSI design. A useful explanation of the common-mode excitation mechanism, which utilizes the imbalance factor of a transmission line, is also presented. Some of the results were investigated by implementing prototypes of a high-speed EMI simulator, HISES.

キーワード
printed circuit board
modeling
power-bus resonance
device
model
common mode
imbalance
EMI simulator
HISES
備考
Published with permission from the copyright holder. This is the institute's copy, as published in Electromagnetic Compatibility, 2003 IEEE International Symposium on, 18-22 Aug. 2003, Volume 1, Pages 4-9.
Publisher URL:http://ieeexplore.ieee.org/search/wrapper.jsp?arnumber=1236554
Copyright © 2003 IEEE. All rights reserved.
発行日
2003-8
出版物タイトル
Electromagnetic Compatibility
1巻
開始ページ
4
終了ページ
9
資料タイプ
学術雑誌論文
言語
English
査読
有り
Submission Path
electricity_and_magnetism/112